What the buyer wrote
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards. The bond test system shall allow the CSA Catapult to perform in-house measurements of die bonded (bonding of a chip to a substrate using a variety of attachment techniques) and wire bonded (mechanically attached wi…
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Awarded to
Details
- What the buyer calls it
- Bond Tester
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Suitable for small firms
- The buyer says yes. What that is worth
- Work starts
- 3 Oct 2019
- Work ends
- 3 Oct 2022
Who the buyer named
The buyer published a contact address on this notice.