What the buyer wrote
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards. The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module lev…
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Awarded to
Details
- What the buyer calls it
- Die Bonder
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Suitable for small firms
- The buyer says yes. What that is worth
- Work starts
- 23 May 2019
- Work ends
- 19 Jun 2022
Who the buyer named
The buyer published a contact address on this notice.