GB-LIVERPOOL: Manual Die Placement System for Glueing & Bump Bonding
What the buyer wrote
Tender for the supply of a die bonding system suitable for the glueing of silicon dies with epoxy and filled anisotropically conductive glues as well as for bump bonding with Indium, PbZn and AgZn solder balls. The system will be housed in the Liverpool Semiconductor Detector Centre (LSDC), Department of Physics, University of Liverpool. Additional information: The contracting authority considers that this contract may be suitable for economic operators that are small or medium enterprises (SMEs). However, any selection of tenderers will be based solely on the criteria set out for the procurement.Please note the return date is 19/01/2016 at 12 noon and the documentation is located on the …
Details
- What the buyer calls it
- GB-LIVERPOOL: Manual Die Placement System for Glueing & Bump Bonding
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Suitable for small firms
- The buyer says yes. What that is worth
- Work starts
- 1 Mar 2016
- Work ends
- 31 Aug 2016
Who the buyer named
A Bickerstaffe was the named contact on this notice.