Laser Dicing and Drilling System
What the buyer wrote
The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes. As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium a…
Details
- What the buyer calls it
- Laser Dicing and Drilling System
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Where
- in Wales
Who the buyer named
The buyer published a contact address on this notice.