What the buyer wrote
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology, we require a digital microscope to perform measurement and imaging of semiconductor-die, packages at various stages of assembly, modules and populated/unpopulated printed circuit boards (PCBs). The measurement system shall allow the CSA Catapult to perform in-house 3D geometrical measurement thr…
Details
- What the buyer calls it
- Metrology Microscope
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Suitable for small firms
- The buyer says yes. What that is worth
- Work starts
- 8 Jan 2021
- Work ends
- 7 Jan 2024
Who the buyer named
The buyer published a contact address on this notice.