Semi-Automatic Wire Bonder
What the buyer wrote
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we are looking to increase our capacity with wire bonding. We currently have a Hesse BJ653 with five bondheads to provide the capability to bond in a variety of applications. This includes fine wire bonding - ball-wedge, wedge-wedge and stud bumping using gold and aluminium wires. There are heavy w…
Details
- What the buyer calls it
- Semi-Automatic Wire Bonder
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Suitable for small firms
- The buyer says yes. What that is worth
- Work starts
- 18 Dec 2020
- Work ends
- 17 Dec 2023
Who the buyer named
The buyer published a contact address on this notice.