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Silicon Wafers for Test Chips

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What the buyer wrote

As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing. Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation. Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging d…

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Details

What the buyer calls it
Silicon Wafers for Test Chips
How they are buying
Given to one supplier, no competitionNobody else was asked, and the buyer has to be able to justify that.
Work starts
17 Jul 2025
Work ends
31 Jan 2026
Where
in the South East

Who the buyer named

The buyer published a contact address on this notice.

finance-tenders@open.ac.uk