Sub-Micron Bonder

The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds. As part of the package assembly research and development methodology we require a machine to perform sub-micron die placement for several growth areas in compound semiconductor packaging. This machine shall be capable of handling very small die in applications where their precision placement is a high priority; typical exampl…

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