Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT
What the buyer wrote
The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of t…
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Awarded to
Details
- What the buyer calls it
- Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Where
- in Scotland
- Kind of work
- Waste collection and recycling
Who the buyer named
Maureen McMillan was the named contact on this notice.