What the buyer wrote
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. This requirement is split into two separate lots
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Details
- What the buyer calls it
- Supply of Semiconductor Dicing and Grinding Systems
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Lots
- 2
- Where
- in Wales
Who the buyer named
Chris Grant was the named contact on this notice.