What the buyer wrote
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) develop detectors to cover a broad range of scientific measurement in the X-Ray, infrared, visible light, neutron, gamma ray parts of the EM spectrum. UKRI-STFC require a flip chip bonder which will perform the assembly of such a range of radiation sensitive detectors. The detectors generally consist of a 2D array of complementary metal oxide semiconductor (CMOS) readout integrated circuit (ROIC), bonded to a geometrically similar 2D array of solid-state sensor material to form a hybrid pixel sensor. In many cases, the ROIC is silicon, but often the sensor is selected to provide specific detection properties…
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Awarded to
Details
- What the buyer calls it
- UK SBS PR19072 Flip Chip Aligner
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Suitable for small firms
- The buyer says yes. What that is worth
- Work starts
- 17 Dec 2019
- Work ends
- 31 Jul 2020
- Kind of work
- Website design and development
Who the buyer named
UKSBS Professional Services Team was the named contact on this notice.