What the buyer wrote
The final date and time for the submission of bids is Wednesday 1st of February 2017 at 11:00am. DO NOT apply directly to the buyer. All tender information MUST be submitted through the CCS eSourcing Portal. Brief Description of Requirement This requirement is for a 14-layer printed circuit board (PCB) style interposer constructed using high-density interconnect build-up technology from ultra-thin PCB laminates. Its purpose is to connect a 6400 pin HEXITEC processor chip on one side of the interposer to a 6400 pin-pin HEXITEC CZT detector on the other side. Please ensure you review all attached information to ensure a full understanding of this requirement. All attachment…
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Awarded to
Details
- What the buyer calls it
- UK SBS RE17006 14-Layer PCB Interposer
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Suitable for small firms
- The buyer says yes. What that is worth
- Work starts
- 8 Feb 2017
- Work ends
- 12 May 2017
Who the buyer named
Rebecca Fish was the named contact on this notice.