UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
What the buyer wrote
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
Bid for this and lost? There is a short window in which the decision can be questioned.
Awarded to
Details
- What the buyer calls it
- UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
- How they are buying
- Given to one supplier, no competitionNobody else was asked, and the buyer has to be able to justify that.
- Type
- goods
- Where
- in the South East
Who the buyer named
The buyer published a contact address on this notice.