Wafer Dicing Saw and Post Wafer Cleaning
What the buyer wrote
The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing. This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge structures w…
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Details
- What the buyer calls it
- Wafer Dicing Saw and Post Wafer Cleaning
- How they are buying
- Advertised, open to anyoneAny supplier could bid without being invited first.
- Type
- goods
- Where
- in the South East
Who the buyer named
Vicki Becheley was the named contact on this notice.